Title:
誘電体基材上の導電性パターンの電解増厚方法と装置、及び誘電体基材
Document Type and Number:
Japanese Patent JP4754840
Kind Code:
B2
Abstract:
The invention provides a method for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate, comprising the steps of immersing the substrate with the pattern present thereon in an electrolytic bath, electrically contacting in the electrolytic bath a negatively charged electrode with the pattern during immersion of the substrate, and effecting contacting movement in the electrolytic bath of the electrode and the pattern with respect to each other during immersion of the substrate. The invention furthermore provides a device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate.
More Like This:
| JP2011026603 | SURFACE TREATMENT METHOD FOR MASKING TAPE AND WAFER |
| WO/2003/059531 | METHOD FOR COATING A SUBSTRATE HAVING HOLES |
| JPH03226589 | METHOD AND DEVICE FOR PARTIAL ELECTROPLATING |
Inventors:
Peter Jacobs Heraldus Rulemans
Aufstineus Cornelis Maria van Defen
Aufstineus Cornelis Maria van Defen
Application Number:
JP2005031478A
Publication Date:
August 24, 2011
Filing Date:
February 08, 2005
Export Citation:
Assignee:
MEKO EQUIPMENT Engineers Besloten Fennaught Shap
International Classes:
C25D5/02; C25D5/04; C25D7/00; C25D7/06; C25D21/00; H05K3/18; H05K3/24; H05K1/00
Domestic Patent References:
| JP47012205A | ||||
| JP2001303299A | ||||
| JP63297588A | ||||
| JP49016175B1 | ||||
| JP45040763B1 |
Foreign References:
| WO2002053807A1 | ||||
| US6322684 |
Attorney, Agent or Firm:
Atsushi Aoki
Jun Tsuruta
Tetsuro Shimada
Shinozaki Masami
Masaya Nishiyama
Jun Tsuruta
Tetsuro Shimada
Shinozaki Masami
Masaya Nishiyama