Title:
チップのボンディング装置およびボンディング方法
Document Type and Number:
Japanese Patent JP4762596
Kind Code:
B2
Inventors:
Shinji Sasaguri
Application Number:
JP2005115304A
Publication Date:
August 31, 2011
Filing Date:
April 13, 2005
Export Citation:
Assignee:
Panasonic Corporation
International Classes:
H01L21/52
Domestic Patent References:
| JP2001135651A | ||||
| JP200031171A | ||||
| JP8281173A |
Attorney, Agent or Firm:
Hiroki Naito
Daisuke Nagano
Kentaro Fujii
Daisuke Nagano
Kentaro Fujii