Title:
配線基板用積層体
Document Type and Number:
Japanese Patent JP4768606
Kind Code:
B2
Abstract:
A laminate for wiring board having a polyimide resin layer as insulating layer that has high thermal stability, low hygroscopicity and excellent dimensional stability, being capable of suppressing warpage by humidity without being accompanied by various problems attributed to adhesive layer, and that is slight in any difference of humidity expansion coefficient between TD direction and MD direction, being free of any in-plane anisotropy. This laminate for wiring board is one comprising at least one polyimide resin layer having its one or both major surfaces overlaid with a metal foil, wherein at least one of the polyimide resin layer comprises >=10 mol% of polyimide structural units obtained from a 2,2'-dialkoxybenzidine or 2,2'-diphenoxybenzidine and a tetracarboxylic acid anhydride.
Inventors:
Wang Hongyuan
Noriko Rikiishi
Naoko Osawa
Hironobu Kawasato
Noriko Rikiishi
Naoko Osawa
Hironobu Kawasato
Application Number:
JP2006510413A
Publication Date:
September 07, 2011
Filing Date:
February 21, 2005
Export Citation:
Assignee:
Nippon Steel Chemical Co., Ltd.
International Classes:
H05K1/03; B32B15/08; C08G73/10; C08L79/08; H05K1/05
Domestic Patent References:
| JP2002338710A | 2002-11-27 | |||
| JPH11154314A | 1999-06-08 | |||
| JPS60250031A | 1985-12-10 | |||
| JPH06234916A | 1994-08-23 | |||
| JP2000198842A | 2000-07-18 | |||
| JPH1154862A | 1999-02-26 |
Foreign References:
| WO1998008216A1 | 1998-02-26 |
Attorney, Agent or Firm:
Kazuya Sasaki
Katsuo Naruse
Tomohiro Nakamura
Eiichi Sano
Katsuo Naruse
Tomohiro Nakamura
Eiichi Sano