Title:
多層配線基板の製造方法
Document Type and Number:
Japanese Patent JP4770095
Kind Code:
B2
Inventors:
Satoru Kuramochi
Application Number:
JP2001276083A
Publication Date:
September 07, 2011
Filing Date:
September 12, 2001
Export Citation:
Assignee:
Dai Nippon Printing Co.,Ltd.
International Classes:
H05K1/11; H05K3/46; H05K3/24; H05K3/40
Domestic Patent References:
| JP2001077535A | ||||
| JP10079578A | ||||
| JP2001237542A | ||||
| JP2000101248A | ||||
| JP6204665A | ||||
| JP63099596A |
Attorney, Agent or Firm:
Junzo Yoneda
Hideo Sarada
Hideo Sarada