Title:
半導体装置及びその製造方法
Document Type and Number:
Japanese Patent JP4777082
Kind Code:
B2
Inventors:
Tanaka Taku
Application Number:
JP2006035046A
Publication Date:
September 21, 2011
Filing Date:
February 13, 2006
Export Citation:
Assignee:
Fujitsu Semiconductor Limited
International Classes:
H01L21/8238; H01L21/76; H01L27/092
Domestic Patent References:
| JP10199993A |
Foreign References:
| WO2004032201A1 | ||||
| WO2004061967A1 |
Attorney, Agent or Firm:
Takayoshi Kokubun