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Title:
異種材料の接合方法、接合装置及び接合構造
Document Type and Number:
Japanese Patent JP4780526
Kind Code:
B2
Abstract:

To provide a dissimilar material overlap-joining method capable of performing the high-strength joining without giving high heat input even when a dense oxide film is interposed between joining interfaces of materials formed by overlapping a high melting point material on a low melting point material, a joining device which is favorably used for joining the dissimilar materials, and a joining structure by this method.

When a high melting point material 1 and a low melting point material 2 having melting points different from each other overlap and are joined with each other, both materials 1, 2 are heated by irradiating high energy beams on a surface of the high melting point material 1 while partially breaking an oxide film present on the joining interface. Both heated materials 1, 2 are relatively pressed against each other to continuously or intermittently joined with each other.

COPYRIGHT: (C)2008,JPO&INPIT


Inventors:
Shigeyuki Nakagawa
Kenji Miyamoto
Masayuki Inoue
Application Number:
JP2006161832A
Publication Date:
September 28, 2011
Filing Date:
June 12, 2006
Export Citation:
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Assignee:
Nissan Motor Co., Ltd
International Classes:
B23K20/00; B23K103/04; B23K103/16; B23K103/18; B23K103/20
Domestic Patent References:
JP57195593A
JP2002331373A
JP2004122171A
JP2004291090A
JP2005169418A
JP2007152401A
Attorney, Agent or Firm:
Janggi Motonori