Title:
基板実装端子台、およびこの基板実装端子台を備えた組立体
Document Type and Number:
Japanese Patent JP4785895
Kind Code:
B2
Inventors:
Hideki Mune
Application Number:
JP2008196001A
Publication Date:
October 05, 2011
Filing Date:
July 30, 2008
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H01R9/00; H01R12/51; H01R24/76
Domestic Patent References:
| JP63082382U | ||||
| JP63150474U | ||||
| JP2002246081A | ||||
| JP61121778U | ||||
| JP2000100504A |
Attorney, Agent or Firm:
Hisao Kobayashi
Kiyoshi Yasushima
Takanashi Norio
Motoki Shandong
Taku Ogawa
Murata Kensei
Moto Otani
Kiyoshi Yasushima
Takanashi Norio
Motoki Shandong
Taku Ogawa
Murata Kensei
Moto Otani