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Title:
半導体エピタキシャルウェーハの製造方法
Document Type and Number:
Japanese Patent JP4791694
Kind Code:
B2
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Inventors:
Maehara Hidenobu
Application Number:
JP2004014369A
Publication Date:
October 12, 2011
Filing Date:
January 22, 2004
Export Citation:
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Assignee:
sumco tech xiv Co., Ltd.
International Classes:
H01L21/304; B24B37/08; B24B37/10
Attorney, Agent or Firm:
Takahisa Kimura
Yoshiyuki Obata



 
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