Title:
純銅板の製造方法及び純銅板
Document Type and Number:
Japanese Patent JP4792116
Kind Code:
B2
Abstract:
Disclosed is a pure copper plate production method wherein post-hot-forging and post-hot-rolling cold forging and cold rolling, and subsequent heat processing are unnecessary. Further disclosed is a pure copper plate having a fine structure which is obtained according to the disclosed production method and which is provided with a high special grain boundary ratio due to the formation of a twin crystal structure by means of partial recrystalisation, and is particularly suitable for copper target members for sputtering, or anodes for plating, or similar. A pure copper ingot having a purity level of 99.96 weight% or higher is heated to 550-800°C. A hot-rolling process is carried out wherein the total rolling rate is 85% or higher, the temperature at rolling completion is 500-700°C, and which includes at least one finishing rolling pass having a rolling reduction rate for one pass of 5-24%. Then, rapid cooling from the rolling completion temperature to 200°C or lower is carried out at a cooling speed of 200-1000°C/min, as required.
Inventors:
Toshihiro Sakai
Takahiro Takeda
Koichi Kita
Kazumasa Maki
Hiroyuki Mori
Takahiro Takeda
Koichi Kita
Kazumasa Maki
Hiroyuki Mori
Application Number:
JP2010026455A
Publication Date:
October 12, 2011
Filing Date:
February 09, 2010
Export Citation:
Assignee:
Mitsubishi Shindoh Co., Ltd.
Mitsubishi Materials Corporation
Mitsubishi Materials Corporation
International Classes:
C22F1/08; B21B3/00; C23C14/34; C25D17/10; C22F1/00
Domestic Patent References:
| JP2005533187A | ||||
| JP2002220659A | ||||
| JP11158614A | ||||
| JP2001240949A | ||||
| JP62112763A |
Attorney, Agent or Firm:
Masakazu Aoyama