Title:
エポキシ樹脂組成物及び半導体装置
Document Type and Number:
Japanese Patent JP4794706
Kind Code:
B2
Inventors:
Ueda Shigehisa
Application Number:
JP27683698A
Publication Date:
October 19, 2011
Filing Date:
September 30, 1998
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
C08G59/24; C08K3/36; C08G59/40; C08L63/00; H01L23/29; H01L23/31
Domestic Patent References:
| JP8269167A | ||||
| JP9176286A |