To provide a washing apparatus which when washing by its brush such a substrate as a glass substrate, a mask substrate, and a semiconductor wafer, can wash the substrate in a clean state by providing such a mechanism that washes the substrate in a clean state without degrading its brush itself, and removes the contaminants penetrated even into the inside of its brush and further, stabilizes the washing effect by its brush, and moreover, can reduce the replacing frequency of its brush.

The washing apparatus includes such a mechanism that the degrading of its brush can be avoided while removing the contaminants penetrating even into the inside of its brush, by making its washing liquid flow through the inside of its brush from the rear surface of its brush in the direction to the plane wherewith its washed object is contacted.

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