Title:
シリコン表面および層のためのエッチングペースト
Document Type and Number:
Japanese Patent JP4837285
Kind Code:
B2
Abstract:
Medium for etching silicon surfaces and layers is a thickened alkaline liquid. An Independent claim is also included for an etching process, in which this medium is applied to all or the required part of the surface and removed again after an action time of 30 seconds to 5 minutes.
Inventors:
Couverbeck, Armin
Klein, Silke
Stockum, Werner
Klein, Silke
Stockum, Werner
Application Number:
JP2004540559A
Publication Date:
December 14, 2011
Filing Date:
August 08, 2003
Export Citation:
Assignee:
Merck Patent Gesellschaft mit beschraenkter Haftung
International Classes:
H01L21/306; C09K13/02
Domestic Patent References:
| JPS591680A | 1984-01-07 | |||
| JPS58113376A | 1983-07-06 | |||
| JPH0242766A | 1990-02-13 |
Foreign References:
| WO2001083391A1 | 2001-11-08 |
Attorney, Agent or Firm:
Kiyoji Kuzuwa