Title:
プリアプライド用封止樹脂組成物及びそれを用いた半導体装置の製造方法
Document Type and Number:
Japanese Patent JP4852893
Kind Code:
B2
Inventors:
Satoshi Katsura
Sakamoto Yuji
Sakamoto Yuji
Application Number:
JP2005159900A
Publication Date:
January 11, 2012
Filing Date:
May 31, 2005
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
C08L63/00; C08G59/62; H01L21/60; H01L23/29; H01L23/31
Domestic Patent References:
| JP2003212964A | ||||
| JP2004186204A | ||||
| JP2000345010A | ||||
| JP2189958A |
Attorney, Agent or Firm:
Shinji Hayami