Title:
基材の熱的保護での熱可塑性組成物の使用
Document Type and Number:
Japanese Patent JP4866370
Kind Code:
B2
Abstract:
The invention relates to the use of a thermoplastic composition in a nanostructured form, said composition essentially comprising a grafted copolymer with polyamide blocks, consisting of a polyolefin trunk selected from the maleic ethylene anhydride and maleic alkyl anhydride ethylene (meth)acrylate copolymers, and at least one polyamide graft, for the thermal protection of a substrate, at a temperature higher than 150° C. The invention is characterised in that at least one layer of said composition is deposited on the substrate. According to a preferred embodiment, the coating layer is deposited by coextrusion on the substrate layer, especially for obtaining tubes or pipes used in petrol lines.
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Inventors:
Beaumel, Martin
Hula, Jean-Jack
Amru, Nicola
Hula, Jean-Jack
Amru, Nicola
Application Number:
JP2007554601A
Publication Date:
February 01, 2012
Filing Date:
February 10, 2006
Export Citation:
Assignee:
Arkema France
International Classes:
B32B27/28; C08G81/02; C08L23/26
Domestic Patent References:
| JP2004510865A | 2004-04-08 | |||
| JP2004299397A | 2004-10-28 | |||
| JP2000313079A | 2000-11-14 |
Attorney, Agent or Firm:
Takashi Koshiba