Title:
接合用材料及び接合方法
Document Type and Number:
Japanese Patent JP4872663
Kind Code:
B2
Abstract:
A bonding material comprising metal particles coated with an organic substance having carbon atoms of 2 to 8, wherein the metal particles comprises first portion of 100 nm or less, and a second portion larger than 100 nm but not larger than 100 μm, each of the portions having at least peak of a particle distribution, based on a volumetric base. The disclosure is further concerned with a bonding method using the bonding material.
Inventors:
Yusuke Yasuda
Toshiaki Morita
Eiichi Ide
Hozoji Hiroyuki
Toshiaki Ishii
Toshiaki Morita
Eiichi Ide
Hozoji Hiroyuki
Toshiaki Ishii
Application Number:
JP2006353649A
Publication Date:
February 08, 2012
Filing Date:
December 28, 2006
Export Citation:
Assignee:
株式会社日立製作所
International Classes:
B22F1/052; B22F1/102; B23K35/22; B23K35/30; B23K35/40; B22F9/24
Domestic Patent References:
| JP2004107728A | ||||
| JP2006089818A |
Attorney, Agent or Firm:
Manabu Inoue