Title:
基板集積システム及び方法
Document Type and Number:
Japanese Patent JP4898116
Kind Code:
B2
Abstract:
A substrate compiling system (1000) includes an actuator (1500), cable (1600) and tamper device (1100). The tamper device (1100) includes a clamp assembly (1300). The clamp assembly (1300) is retracted and extended. The clamp assembly (1300) can be used to clamp an edge of each compiled set of substrates (10) and transfer the compiled set to a stacking tray, platform or the like (440). The clamp assembly (1300) may remain in an extended position until all other substrate supporting structures no longer support the substrates (10) and an opposing unclamped edge of the compiled set engages the stacking tray (440) below.
Inventors:
Douglas Kay Herman
Timothy M. Davis
Matthew Jay Ross
Brian Jay Dunham
Timothy M. Davis
Matthew Jay Ross
Brian Jay Dunham
Application Number:
JP2004366882A
Publication Date:
March 14, 2012
Filing Date:
December 17, 2004
Export Citation:
Assignee:
XEROX CORPORATION
International Classes:
B65H29/28; B65H31/34; B65H9/10; B65H29/26; B65H31/32; B65H33/08
Domestic Patent References:
| JP834558A | ||||
| JP274144U | ||||
| JP58220040A |
Foreign References:
| GB2158272A |
Attorney, Agent or Firm:
Kenji Yoshida
Jun Ishida
Jun Ishida