To provide a pressure-sensitive adhesive sheet for dicing slightly forming filamentous wastes during dicing without deteriorating product quality or causing disadvantages to cost and to provide a method for dicing using the pressure-sensitive adhesive sheet for dicing.
The pressure-sensitive adhesive sheet 10 for dicing has a pressure-sensitive adhesive layer 12 on at least one surface of a substrate 11. Furthermore, the substrate 11 is provided with a multilayer structure having a layer 11a containing an ethylenic resin having ≤95°C melting point. The pressure-sensitive adhesive sheet for dicing is characterized in that the thickness of the layer 11a is ≥1/2 of the total thickness of the substrate 11.
COPYRIGHT: (C)2007,JPO&INPIT
JP2004303999A | ||||
JP5156214A | ||||
JP2003257894A |
Koichi Kajisaki
Yuzo Ozaki
Toshihiko Taniguchi