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Title:
ダイシング用粘着シート、及びそれを用いたダイシング方法
Document Type and Number:
Japanese Patent JP4993662
Kind Code:
B2
Abstract:

To provide a pressure-sensitive adhesive sheet for dicing slightly forming filamentous wastes during dicing without deteriorating product quality or causing disadvantages to cost and to provide a method for dicing using the pressure-sensitive adhesive sheet for dicing.

The pressure-sensitive adhesive sheet 10 for dicing has a pressure-sensitive adhesive layer 12 on at least one surface of a substrate 11. Furthermore, the substrate 11 is provided with a multilayer structure having a layer 11a containing an ethylenic resin having ≤95°C melting point. The pressure-sensitive adhesive sheet for dicing is characterized in that the thickness of the layer 11a is ≥1/2 of the total thickness of the substrate 11.

COPYRIGHT: (C)2007,JPO&INPIT


Inventors:
Masashi Yamamoto
Application Number:
JP2006102104A
Publication Date:
August 08, 2012
Filing Date:
April 03, 2006
Export Citation:
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Assignee:
NITTO DENKO CORPORATION
International Classes:
C09J7/02; C09J4/00; H01L21/301
Domestic Patent References:
JP2004303999A
JP5156214A
JP2003257894A
Attorney, Agent or Firm:
Patent Business Corporation Unias International Patent Office
Koichi Kajisaki
Yuzo Ozaki
Toshihiko Taniguchi



 
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