Title:
半導体デバイスにおける相互接続層上の一対の相互接続部の間にエアーギャップを形成する方法
Document Type and Number:
Japanese Patent JP5004585
Kind Code:
B2
Abstract:
An adjustable self aligned low capacitance integrated circuit air gap structure comprises a first interconnect adjacent a second interconnect on an interconnect level, spacers formed along adjacent sides of the first and second interconnects, and an air gap formed between the first and second interconnects. The air gap extends above an upper surface of at least one of the first and second interconnects and below a lower surface of at least one of the first and second interconnects, and the distance between the spacers defines the width of the air gap. The air gap is self-aligned to the adjacent sides of the first and second interconnects.
Inventors:
Gefken, Robert, M
Motosiff, William, Tee
Motosiff, William, Tee
Application Number:
JP2006534155A
Publication Date:
August 22, 2012
Filing Date:
September 30, 2004
Export Citation:
Assignee:
INTERNATIONAL BUSINESS MASCHINES CORPORATION
International Classes:
H01L23/532; H01L21/768; H01L23/522
Domestic Patent References:
| JP2001110745A | ||||
| JP11126820A |
Foreign References:
| US6413852 | ||||
| FR2784230A1 | ||||
| US20020127844 |
Attorney, Agent or Firm:
Takeshi Ueno
Tasaichi Tanae
Yoshihiro City
Hiroshi Sakaguchi
Tasaichi Tanae
Yoshihiro City
Hiroshi Sakaguchi