Title:
基板処理装置
Document Type and Number:
Japanese Patent JP5006122
Kind Code:
B2
Abstract:
A substrate treating apparatus includes a plurality of substrate treatment lines arranged vertically. Each substrate treatment line has a plurality of main transport mechanisms arranged horizontally, and a plurality of treating units provided for each main transport mechanism for treating substrates. A series of treatments is carried out for the substrates, with each main transport mechanism transporting the substrates to the treating units associated therewith, and transferring the substrates to the other main transport mechanism horizontally adjacent thereto. The substrate treating apparatus realizes increased processing capabilities by treating the substrates in parallel through the substrate treatment lines.
Inventors:
Yoshimitsu Fukutomi
Takeshi Mihashi
Hiroyuki Ogura
Kenya Morinishi
Yasuo Kawamatsu
Hiroji Nagashima
Takeshi Mihashi
Hiroyuki Ogura
Kenya Morinishi
Yasuo Kawamatsu
Hiroji Nagashima
Application Number:
JP2007172496A
Publication Date:
August 22, 2012
Filing Date:
June 29, 2007
Export Citation:
Assignee:
Sokudo corporation
International Classes:
H01L21/677; H01L21/00; H01L21/027
Domestic Patent References:
| JP2007005659A | ||||
| JP2000269297A | ||||
| JP2005243690A | ||||
| JP2003338496A | ||||
| JP9045613A | ||||
| JP2005093920A | ||||
| JP10146744A | ||||
| JP2004015023A | ||||
| JP11251405A | ||||
| JP1241840A | ||||
| JP2006269672A | ||||
| JP2001093827A |
Attorney, Agent or Firm:
Tsutomu Sugiya
Hiroyuki Todaka
Hiroyuki Todaka