Title:
ダイボンディング用熱硬化性フィルム及びこれを用いた半導体装置の製造方法
Document Type and Number:
Japanese Patent JP5009752
Kind Code:
B2
Inventors:
Shin Teraki
Masaki Yoshida
Masaki Yoshida
Application Number:
JP2007284125A
Publication Date:
August 22, 2012
Filing Date:
October 31, 2007
Export Citation:
Assignee:
Namics Co., Ltd.
International Classes:
H01L21/52; C09J7/00
Domestic Patent References:
| JP11269264A | ||||
| JP2003347323A | ||||
| JP2003100953A | ||||
| JP2002138270A | ||||
| JP2007273768A |
Attorney, Agent or Firm:
Hajime Tsukuni
Koshiro Tsukuda
Fusayuki Saito
Koshiro Tsukuda
Fusayuki Saito