Title:
マイクロメカニカル構成素子及び相応する製造法
Document Type and Number:
Japanese Patent JP5026653
Kind Code:
B2
Abstract:
A micromechanical component includes: a substrate; a micromechanical functional plane provided on the substrate; a covering plane provided on the micromechanical functional plane; and a printed circuit trace plane provided on the covering plane. The covering plane includes a monocrystalline region which is epitaxially grown on an underlying monocrystalline region, and the covering plane includes a polycrystalline region which is epitaxially grown on an underlying polycrystalline starting layer at the same time.
Inventors:
Michael Offenberg
Marx Lutz
Marx Lutz
Application Number:
JP2001575491A
Publication Date:
September 12, 2012
Filing Date:
March 22, 2001
Export Citation:
Assignee:
ROBERT BOSCH GMBH
International Classes:
B81B3/00; G01P15/08; B81B7/02; B81C1/00; H01L29/84; H01L21/20
Domestic Patent References:
| JP10163168A | ||||
| JP11325916A | ||||
| JP2001009799A |
Attorney, Agent or Firm:
Ryoichi Shino
Shuichi Sumiyoshi
Yasushi Miyagi
Kiyoshi Kuruma
Toshio Yano
Takuya Kuno
Einzel Felix-Reinhard
Shuichi Sumiyoshi
Yasushi Miyagi
Kiyoshi Kuruma
Toshio Yano
Takuya Kuno
Einzel Felix-Reinhard