Title:
プラズマ処理チャンバの選択的プレコーティングのための方法及び装置
Document Type and Number:
Japanese Patent JP5028430
Kind Code:
B2
Abstract:
A method for processing a substrate in a plasma processing system is provided. The method includes disposing a first confinement ring set in a first position. The method also includes depositing a first coating on a first portion of the plasma processing system using a first plasma in a first area defined by the first confinement ring set in the first position. The method further includes depositing a second coating on a second portion of the plasma processing system using a second plasma in a second area between the first confinement ring set in the first position and a second confinement ring set. The method yet also includes processing the substrate using a third plasma with the first confinement ring set disposed in a second position.
More Like This:
| JPH0971489 | SURFACE MODIFICATION OF CARBON MATERIAL |
| JP2011003730 | SILICON RING FOR PLASMA TREATMENT APPARATUS |
| JPH0314229 | END POINT DETECTING DEVICE |
Inventors:
Fisher, Andreas
Application Number:
JP2008557502A
Publication Date:
September 19, 2012
Filing Date:
March 01, 2007
Export Citation:
Assignee:
LAM RESEARCH CORPORATION
International Classes:
H01L21/3065; C23C16/44
Domestic Patent References:
| JP10096082A | ||||
| JP10313047A | ||||
| JP2002110565A | ||||
| JP2004511096A |
Foreign References:
| US20060011138 |
Attorney, Agent or Firm:
Hiroe Associates Patent Office