Title:
半導体装置の製造方法、クリーニング方法および基板処理装置
Document Type and Number:
Japanese Patent JP5036849
Kind Code:
B2
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Inventors:
Masanori Sakai
Yukinao Kaga
Takashi Yokokawa
Tatsuyuki Saito
Yukinao Kaga
Takashi Yokokawa
Tatsuyuki Saito
Application Number:
JP2010154278A
Publication Date:
September 26, 2012
Filing Date:
July 06, 2010
Export Citation:
Assignee:
Hitachi Kokusai Electric Co., Ltd.
International Classes:
C23C16/44; H01L21/31; H01L21/318
Foreign References:
| WO2004070079A1 | ||||
| US6589611 |
Attorney, Agent or Firm:
Toru Yui
Aniya Setsuo
Hitoshi Kiyono
Fukuoka Masahiro
Aniya Setsuo
Hitoshi Kiyono
Fukuoka Masahiro