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Title:
半導体装置
Document Type and Number:
Japanese Patent JP5041724
Kind Code:
B2
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Inventors:
Junichiro Oike
Application Number:
JP2006112931A
Publication Date:
October 03, 2012
Filing Date:
April 17, 2006
Export Citation:
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Assignee:
LAPIS Semiconductor Co., Ltd.
International Classes:
H01L27/04; H01L21/822
Domestic Patent References:
JP62030358U
JP6188371A
JP8023072A
JP10150154A
JP2003152079A
JP5284031A
JP2000208703A
JP6140358A
JP61229302A
JP2006185930A
Attorney, Agent or Firm:
Kakimoto Yasunari



 
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