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Title:
PCB汚染物の分離処理方法
Document Type and Number:
Japanese Patent JP5052027
Kind Code:
B2
Abstract:

To provide a separation treatment method for separating and removing PCB from powder-like PCB contaminant such as sludge or soil at improved treatment efficiency.

The PCB contaminant separation treatment method comprises: a separation process of adding a separation assistant d to the PCB contaminant p, supplying it to a vacuum heating separation furnace 1, bringing the PCB contaminant into a pressure-reduced state by a vacuum pump 9 communicated with the vacuum heating separation furnace 1 and also heating and evaporating the PCB contained in the PCB contaminant p; and an absorption process of introducing the PCB to an oil shower column 2 arranged between the vacuum heating separation furnace 1 and the vacuum pump 9, bringing it into contact with oil and condensing and absorbing it.

COPYRIGHT: (C)2008,JPO&INPIT


Inventors:
Mitsuo Ohno
Ono Satoshi
Nishimura Masazumi
Yoshihiko Kawachi
Application Number:
JP2006097523A
Publication Date:
October 17, 2012
Filing Date:
March 31, 2006
Export Citation:
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Assignee:
Mitsui Shipbuilding Co., Ltd.
International Classes:
B09C1/06; B01D53/70; B01D53/77; C02F11/12
Domestic Patent References:
JP2005211827A
JP2006021165A
JP9318029A
JP2005030465A
JP7207278A
JP2004034015A
JP2002059145A
JP2003324015A
JP2003275737A
JP2004216289A
JP2004160350A
JP2003275714A
JP11090386A
JP2005161243A
JP2007268424A
Attorney, Agent or Firm:
Shinichi Ogawa
Takashi Noguchi
Kazuhiko Saishita



 
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