Title:
脆性材料基板の分断装置および分断方法
Document Type and Number:
Japanese Patent JP5060880
Kind Code:
B2
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Inventors:
Atsuma Noribun
Koji Yamamoto
Koji Yamamoto
Application Number:
JP2007235832A
Publication Date:
October 31, 2012
Filing Date:
September 11, 2007
Export Citation:
Assignee:
Samsung Diamond Industry Co., Ltd.
International Classes:
B23K26/40; B23K26/064; B23K26/073; B23K26/38; B28D5/00; C03B33/09
Domestic Patent References:
| JP2007099587A | ||||
| JP2002144067A |
Foreign References:
| WO2003013816A1 | ||||
| WO2003008168A1 |
Attorney, Agent or Firm:
Yoshio Kashima