Title:
固体撮像装置及びその製造方法
Document Type and Number:
Japanese Patent JP5061579
Kind Code:
B2
Abstract:
Disclosed is a solid-state imaging device comprising a solid-state imaging device chip, a transparent plate so arranged as to face the light-receiving surface of the solid-state imaging device chip, aspacer arranged like a frame at the peripheral portion of the light-receiving surface of the solid-state imaging device chip for keeping the distance between the solid-state imaging device chip and the transparent plate constant, and an adhesive layer for sealing the periphery of the space between the solid-state imaging device chip and the transparent plate. This solid-state imaging device is characterized in that the spacer is composed of a plurality of partition walls.
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Inventors:
Katsumi Yamamoto
Application Number:
JP2006299333A
Publication Date:
October 31, 2012
Filing Date:
November 02, 2006
Export Citation:
Assignee:
Toppan Printing Co., Ltd.
International Classes:
H01L27/14; H04N5/335; H04N5/369
Domestic Patent References:
| JP2002231919A | ||||
| JP2006147864A | ||||
| JP2003092394A | ||||
| JP2004193600A | ||||
| JP62052742A | ||||
| JP1094548A |
Attorney, Agent or Firm:
Makoto Nakamura
Kurata Masatoshi
Takashi Mine
Yoshihiro Fukuhara
Sadao Muramatsu
Ryo Hashimoto
Kurata Masatoshi
Takashi Mine
Yoshihiro Fukuhara
Sadao Muramatsu
Ryo Hashimoto