Title:
配線基板及びその製造方法
Document Type and Number:
Japanese Patent JP5063672
Kind Code:
B2
Inventors:
Riki Mae
Hiroshi Kurume
Hitoshi Castle
Akihiro Suzuki
Hiroshi Kurume
Hitoshi Castle
Akihiro Suzuki
Application Number:
JP2009281901A
Publication Date:
October 31, 2012
Filing Date:
December 11, 2009
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H05K1/18; H01R4/38; H05K3/32
Domestic Patent References:
| JP2001332847A | ||||
| JP2009289734A | ||||
| JP6064367U |
Attorney, Agent or Firm:
Hiroaki Sakai