Title:
半導体装置の作製方法、及び半導体装置
Document Type and Number:
Japanese Patent JP5063770
Kind Code:
B2
Abstract:
An IC card is more expensive than a magnetic card, and an electronic tag is also more expensive as a substitute for bar codes. Therefore, the present invention provides an extremely thin integrated circuit that can be mass-produced at low cost unlike a chip of a conventional silicon wafer, and a manufacturing method thereof. One feature of the present invention is that a thin integrated circuit is formed by a formation method that can form a pattern selectively, on a glass substrate, a quartz substrate, a stainless substrate, a substrate made of synthetic resin having flexibility, such as acryl, or the like except for a bulk substrate. Further, another feature of the present invention is that an ID chip in which a thin film integrated circuit and an antenna according to the present invention are mounted is formed.
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Inventors:
Shinji Maekawa
Genki Fujii
Junya Maruyama
Toru Takayama
Yumiko Fukumoto
Yasuyuki Arai
Genki Fujii
Junya Maruyama
Toru Takayama
Yumiko Fukumoto
Yasuyuki Arai
Application Number:
JP2010263413A
Publication Date:
October 31, 2012
Filing Date:
November 26, 2010
Export Citation:
Assignee:
Semiconductor Energy Laboratory Co., Ltd.
International Classes:
G06K19/077; G06K19/07; H01L21/336; H01L21/77; H01L21/84; H01L27/12; H01L27/13; H01L29/786
Domestic Patent References:
| JP2003123047A | ||||
| JP2003006592A | ||||
| JP2002366917A |