Title:
クリーニング方法
Document Type and Number:
Japanese Patent JP5084508
Kind Code:
B2
Abstract:
In a process chamber of a substrate processing apparatus, such as an RTP apparatus, a carrier is placed and configured to carry out a contaminant that has been attached to it. In this state, a cleaning gas containing N2 and O2 is introduced into the process chamber, and cleaning is performed under conditions including a pressure of 133.3 Pa or less and a temperature of 700° C. to 1,100° C. This cleaning is repeatedly performed by sequentially replacing a plurality of carriers.
Inventors:
Koji Maekawa
Application Number:
JP2007533291A
Publication Date:
November 28, 2012
Filing Date:
August 30, 2006
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/26
Domestic Patent References:
| JP2002025924A | 2002-01-25 | |||
| JPH09260303A | 1997-10-03 | |||
| JPH10317142A | 1998-12-02 | |||
| JP2004311894A | 2004-11-04 | |||
| JP2005072291A | 2005-03-17 | |||
| JPH03295232A | 1991-12-26 |
Attorney, Agent or Firm:
Hiroshi Takayama