Title:
通信機器
Document Type and Number:
Japanese Patent JP5087118
Kind Code:
B2
Abstract:
A communication device according to an embodiment includes an antenna transmitting/receiving a high frequency signal, a semiconductor chip having four corners and four sides processing the high frequency signal, and a substrate on which a first wiring connected to ground, a second wiring supplying power to the semiconductor chip, a third wiring connected to a protection element or circuit of the semiconductor chip, and fourth wirings transmitting a signal from the semiconductor chip are formed by plating, and the semiconductor chip is mounted.
Inventors:
Naoko Ono
Toshiya Mitomo
Toshiya Mitomo
Application Number:
JP2010216711A
Publication Date:
November 28, 2012
Filing Date:
September 28, 2010
Export Citation:
Assignee:
Toshiba Corporation
International Classes:
H01Q23/00; H01L23/12; H01Q1/38; H01Q1/40; H01Q1/52; H04B1/40
Domestic Patent References:
| JP2009170563A | ||||
| JP2006101494A | ||||
| JP2007300266A | ||||
| JP2001267463A | ||||
| JP2005340741A | ||||
| JP2011091598A |
Attorney, Agent or Firm:
Patent Business Corporation Sakura International Patent Office