Title:
レーザー加工装置、被加工物の加工方法および被加工物の分割方法
Document Type and Number:
Japanese Patent JP5104920
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a laser beam machining device which suppresses formation of machining marks, and further can form division starting points more securely achieving the division of the workpiece.SOLUTION: The laser beam machining device includes: a light source emitting pulse laser beams; and a placing part on which a workpiece is placed. The laser beam machining device further includes a stress applying means of making tensile stress act on the positions to be machined in the workpiece placed on the placing part by applying force to the workpiece by three point bending. For the workpiece placed on the placing part, in a state where tensile stress is made to act on the positions to be machined by the stress applying means, while moving the placement part so that the regions to be irradiated per unit pulse beam of the pulse laser beams are discretely formed in the faces to be machined, the workpiece is irradiated with the pulse laser beams. In this way, the cleavages or partings of the workpiece are successively produced between the regions to be irradiated to form starting points for division in the workpiece.
More Like This:
| JPS62299909 | OPTICAL FIBER CABLE |
| JP2535852 | [Title of Invention] Beam Positioner Control Circuit |
| JPS5997116 | OPTICAL FIBER CONDENSER |
Inventors:
Nagatomo Shohei
Ikusho Nakatani
Sugita Mitsuru
Ryogo Horii
Ikusho Nakatani
Sugita Mitsuru
Ryogo Horii
Application Number:
JP2010166230A
Publication Date:
December 19, 2012
Filing Date:
July 23, 2010
Export Citation:
Assignee:
Samsung Diamond Industry Co., Ltd.
International Classes:
B23K26/08; B23K26/38; B23K26/40; B28D5/00; C04B41/91; H01L21/301
Domestic Patent References:
| JP10071483A | ||||
| JP2009214182A | ||||
| JP2010082645A | ||||
| JP2008006492A | ||||
| JP2009107301A | ||||
| JP2000270833A |
Foreign References:
| WO2005102638A1 |
Attorney, Agent or Firm:
Yoshitake Hidetoshi
Takahiro Arita
Takahiro Arita
Previous Patent: レーザー加工装置、被加工物の加工方法および被加工物の分割方法
Next Patent: TRAILING ARM TYPE DOUBLE WISHBONE SUSPENSION DEVICE
Next Patent: TRAILING ARM TYPE DOUBLE WISHBONE SUSPENSION DEVICE