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Title:
太陽光モジュールを基板に取り付けるためのシステムおよび方法
Document Type and Number:
Japanese Patent JP5113288
Kind Code:
B2
Abstract:
A spacer used to secure a solar module to a substrate having surface irregularities or unevenness includes a spacer layer located between two adhesive layers. The spacer has a thickness greater than any anticipated irregularities or unevenness on the surface of the substrate. The spacer is comprised of materials that provide sufficient strength and weatherability.

Inventors:
Booth dennis
O'Neal Timothy
Application Number:
JP2011503177A
Publication Date:
January 09, 2013
Filing Date:
April 02, 2009
Export Citation:
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Assignee:
Adeco Products Inc.
International Classes:
H01L31/042; E04D13/18
Domestic Patent References:
JP2000508393A
JP2000223726A
JP10502771A
JP2005539374A
Foreign References:
US6201179
US5242727
Attorney, Agent or Firm:
Kazuko Fujita



 
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