Title:
ポリプロピレン系樹脂組成物
Document Type and Number:
Japanese Patent JP5141230
Kind Code:
B2
Abstract:
There are provided a polypropylene resin composition and a molded article thereof, the composition comprising: 60 to 85% by weight of a propylene homopolymer; and 15 to 40% by weight of an ethylene-α-olefin random copolymer containing 45 to 70 parts by mol of ethylene units, and 30 to 55 parts by mol of α-olefin units, and satisfying the following requirements (1) to (5), (1) the propylene homopolymer has a melting temperature of 163 to 170° C.; (2) the propylene homopolymer contains 0.01% or less of regio defects resulted from a 2,1-insertion and a 1,3-insertion in all propylene units; (3) the polypropylene resin composition has a ratio B/A of 0.9 or more, provided that A (% by weight) is an amount of the ethylene-α-olefin random copolymer contained in the polypropylene resin composition, and B (% by weight) is an amount of soluble parts in xylene at a room temperature contained in the polypropylene resin composition; (4) the ethylene-α-olefin random copolymer has a molecular weight distribution of 2.0 to 4.0; and (5) the ethylene-α-olefin random copolymer contained in the polypropylene resin composition has a shape of a particle, whose volume-average particle diameter is 1.0 μm or less, measured by observing a cross-section of a 0.5 mm-thick sheet with a transmission electron microscopy, the sheet being obtained by hot press-molding the above polypropylene resin composition at 190° C. for 3 minutes under a pressure of 35 kgf/cm2, provided that the cross-section of the above particle has a round shape.
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Inventors:
Yasumi Fujiwara
Shuichi Kizen
Hideki Oshima
Shuichi Kizen
Hideki Oshima
Application Number:
JP2007323135A
Publication Date:
February 13, 2013
Filing Date:
December 14, 2007
Export Citation:
Assignee:
Sumitomo Chemical Co., Ltd.
International Classes:
C08L23/12; C08L23/08
Domestic Patent References:
| JP11269327A | ||||
| JP8012827A | ||||
| JP11349746A |
Attorney, Agent or Firm:
Toru Nakayama