Title:
研磨ヘッド
Document Type and Number:
Japanese Patent JP5185958
Kind Code:
B2
Abstract:
The invention provides structure and method for achieving a uniformly polished or planarized substrate such as a semiconductor wafer including achieving substantially uniform polishing between the center of the semiconductor wafer and the edge of the wafer. In one aspect the invention provides a polishing apparatus including a housing, a carrier for mounting a substrate to be polished, a retaining ring circumscribing the carrier for retaining the substrate, a first coupling attaching the retaining ring to the carrier such that the retaining ring may move relative to the carrier, a second coupling attaching the carrier to the housing such that the carrier may move relative to the housing, the housing and the first coupling defining a first pressure chamber to exert a pressure force against the retaining ring, and the housing and the second coupling defining a second pressure chamber to exert a pressure force against the subcarrier. In one embodiment, the couplings are diaphragms. The invention also provides a retaining ring having a special edge profile that assists in smoothing an pre-compressing the polisihng pad to increase polisihng uniformity. A method for polisihing and a semiconductor manufacture is also provided.
Inventors:
Gerald S. Maloney
Jason Price
Scott Chin
Jiro Kajiwara
Marek Charif
Jason Price
Scott Chin
Jiro Kajiwara
Marek Charif
Application Number:
JP2010020663A
Publication Date:
April 17, 2013
Filing Date:
February 01, 2010
Export Citation:
Assignee:
Ebara Corporation
International Classes:
B24B37/30; B24B37/32; B24B49/16; H01L21/304
Domestic Patent References:
| JP9019863A | ||||
| JP10180617A | ||||
| JP7122523A | ||||
| JP10180627A | ||||
| JP8281553A | ||||
| JP8229808A |
Attorney, Agent or Firm:
Masatake Shiga
Suzuki Mitsuyoshi
Mitsunaga Igarashi
Suzuki Mitsuyoshi
Mitsunaga Igarashi