Title:
接着シート
Document Type and Number:
Japanese Patent JP5196034
Kind Code:
B2
Abstract:
The disclosed adhesive sheet (1) for manufacturing a semiconductor device is provided with: a base film (10); an adhesive layer (20) disposed on top of the base film (10); an adhesive layer (30) that is disposed on top of the first adhesive layer (20) and has an opening (30a) through which the first adhesive layer (20) is exposed; and a die-bonding film (40) disposed on the section (25) of the first adhesive film (20) that is exposed through the aforementioned opening (30a). At least part of the outer edge of the die-bonding film (40) is in contact with the second adhesive layer (30).
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| WO/2006/101091 | LASER MACHINING METHOD |
| JP6322013 | Adhesive sheet |
| JP2937774 | [Title of Invention] Method for manufacturing ceramic electronic component |
Inventors:
Nakamura Yuki
Masanobu Miyahara
Yoji Katayama
Takeshi Tamaki
Keiichi Hatakeyama
Takuji Ikeya
Masanobu Miyahara
Yoji Katayama
Takeshi Tamaki
Keiichi Hatakeyama
Takuji Ikeya
Application Number:
JP2011545576A
Publication Date:
May 15, 2013
Filing Date:
June 14, 2011
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
H01L21/301; C09J7/20; C09J201/00; H01L21/52
Domestic Patent References:
| JP2006111727A | 2006-04-27 | |||
| JP2005203749A | 2005-07-28 | |||
| JP2006111727A | 2006-04-27 | |||
| JP2005203749A | 2005-07-28 |
Foreign References:
| WO2009078221A1 | 2009-06-25 | |||
| WO2009078221A1 | 2009-06-25 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Hiroyuki Hirano
Hiromitsu Nakayama
Yoshinori Shimizu
Hiroyuki Hirano
Hiromitsu Nakayama