Title:
半導体装置の製造方法
Document Type and Number:
Japanese Patent JP5198988
Kind Code:
B2
Inventors:
Morinaga Norifumi
Application Number:
JP2008235959A
Publication Date:
May 15, 2013
Filing Date:
September 16, 2008
Export Citation:
Assignee:
Renesas Electronics Corporation
International Classes:
H01L21/205; C23C16/52
Domestic Patent References:
| JP2000306838A | ||||
| JP2047266A |
Foreign References:
| WO2006049055A1 |
Attorney, Agent or Firm:
Yamato Tsutsui