Title:
圧電デバイス及び圧電デバイスの製造方法
Document Type and Number:
Japanese Patent JP5216290
Kind Code:
B2
Abstract:
Devices are disclosed that include a piezoelectric vibrating piece (30); a glass base (30) and lid (65) form a package enclosing the piezoelectric vibrating piece. The piece has first and second electrodes (35,36). The base has first and second opposing surfaces. The base mounts the piezoelectric vibrating piece, and the lid seals the piezoelectric vibrating piece in the package. The base includes first and second metal wires (23), extending therethrough, whose ends are denuded to the first and second surfaces and connected to the first and second electrodes, respectively. In disclosed methods for making the packaged devices, such as piezoelectric oscillators, multiple packaged devices are made simultaneously by stacking and simultaneously bonding respective wafers on which glass bases, piezoelectric vibrating pieces, and lids have been formed.
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Inventors:
Kozo Ono
Takahiro Inoue
Takahiro Inoue
Application Number:
JP2007251821A
Publication Date:
June 19, 2013
Filing Date:
September 27, 2007
Export Citation:
Assignee:
Nippon Denpa Industry Co., Ltd.
International Classes:
H03H9/02; H01L23/08; H03H3/02
Domestic Patent References:
| JP2007228443A | ||||
| JP2003209198A |
Foreign References:
| WO2006104265A1 |
Attorney, Agent or Firm:
Nobukazu Ito
Previous Patent: JPS5216289
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