Title:
プラズマ処理装置,プラズマ処理方法,プログラム
Document Type and Number:
Japanese Patent JP5227264
Kind Code:
B2
Abstract:
An optimum application voltage for reducing deposits on a peripheral portion of a substrate as well as improving a process result in balance is effectively found without changing a height of a focus ring. A plasma processing apparatus includes a focus ring which includes a dielectric ring provided so as to surround a substrate mounting portion of a mounting table and a conductive ring provided on the dielectric ring; a voltage sensor configured to detect a floating voltage of the conductive ring; a DC power supply configured to apply a DC voltage to the conductive ring. An optimum voltage to be applied to the conductive ring is obtained based on a floating voltage actually detected from the conductive ring, and the optimum application voltage is adjusted based on a variation in the actually detected floating voltage for each plasma process.
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Inventors:
Koshimizu ground salt
Application Number:
JP2009133269A
Publication Date:
July 03, 2013
Filing Date:
June 02, 2009
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/3065
Domestic Patent References:
| JP2008244274A | ||||
| JP2001308079A | ||||
| JP2008227063A | ||||
| JP2006245510A | ||||
| JP2006319043A | ||||
| JP2004260159A | ||||
| JP2010186841A |
Foreign References:
| WO2009006062A1 |
Attorney, Agent or Firm:
Hiroaki Oyama