Title:
樹脂組成物、フィルム付きまたは金属箔付き絶縁樹脂シート、多層プリント配線板、及び半導体装置
Document Type and Number:
Japanese Patent JP5245253
Kind Code:
B2
Inventors:
Great Master Onozuka
Application Number:
JP2007010516A
Publication Date:
July 24, 2013
Filing Date:
January 19, 2007
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
C08L63/04; B32B15/092; C08G59/62; C08K3/22; C08K5/1545; H01B3/40; H05K1/03; H05K3/46
Domestic Patent References:
| JP2006188709A | ||||
| JP2006028274A | ||||
| JP2002053645A | ||||
| JP2006328233A |
Attorney, Agent or Firm:
Shinji Hayami