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Title:
脆性材料基板の加工方法およびこれに用いるレーザ加工装置
Document Type and Number:
Japanese Patent JP5249979
Kind Code:
B2
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Inventors:
Atsushi Imura
Yusuke Hirauchi
Application Number:
JP2010062143A
Publication Date:
July 31, 2013
Filing Date:
March 18, 2010
Export Citation:
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Assignee:
Samsung Diamond Industry Co., Ltd.
International Classes:
B28D5/00; C03B33/09
Domestic Patent References:
JP2005262727A
JP2010138046A
JP2011067856A
Foreign References:
WO2007142264A1
WO2004041493A1
Attorney, Agent or Firm:
Yoshio Kashima



 
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