Title:
半導体パッケージ
Document Type and Number:
Japanese Patent JP5256177
Kind Code:
B2
Abstract:
To prevent the peeling of a die pad and semiconductor chip in a semiconductor package which seals the semiconductor chip by a sealing resin in the state where the semiconductor chip is joined to a top surface of die pad in a plate form by soldering.
The semiconductor package 1 is structured such that: an engagement hole 13 having a bottom and sinking into the thickness direction of a die pad 3 from the top surface 3a is formed on the die pad 3; the engagement hole 13 is placed closer to the semiconductor chip 2 fixed on the die pad 3 than to the peripheral edge of top surface 3a of die pad 3; and a plurality of engagement holes 13 are arranged so as to surround the semiconductor chip 2.
COPYRIGHT: (C)2011,JPO&INPIT
Inventors:
Toshiyuki Tamate
Application Number:
JP2009269773A
Publication Date:
August 07, 2013
Filing Date:
November 27, 2009
Export Citation:
Assignee:
Shindengen Industry Co., Ltd.
International Classes:
H01L23/50; H01L23/28
Domestic Patent References:
| JP2005191178A | ||||
| JP6085132A | ||||
| JP2000150753A | ||||
| JP2002110888A | ||||
| JP49115653A | ||||
| JP49052975A |
Attorney, Agent or Firm:
Masatake Shiga
Tadashi Takahashi
Takashi Watanabe
Suzuki Mitsuyoshi
Kazuya Nishi
Yasuhiko Murayama
Tadashi Takahashi
Takashi Watanabe
Suzuki Mitsuyoshi
Kazuya Nishi
Yasuhiko Murayama
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