Title:
感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
Document Type and Number:
Japanese Patent JP5277679
Kind Code:
B2
Abstract:
To provide a photosensitive resin composition for forming a resist pattern which further satisfies all of sensitivity, resolution and adhesion. The photosensitive resin composition comprises: (A) 100 pts.mass of a binder polymer having 10-65 pts.mass of a divalent group obtained from styrene or a specific derivative thereof, 5-55 pts.mass of a divalent group obtained from a specific (meth) acrylic ester or a derivative thereof, and 15-50 pts.mass of a divalent group obtained from (meth) acrylic acid; (B) a photopolymerizable compound; and (c) a photopolymerization initiator.
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Inventors:
Hanako Minamikawa
Miyasaka Masahiro
Yukiko Muramatsu
Miyasaka Masahiro
Yukiko Muramatsu
Application Number:
JP2008073874A
Publication Date:
August 28, 2013
Filing Date:
March 21, 2008
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
G03F7/033; C08F212/04; C08F220/06; C08F220/10; G03F7/004; G03F7/029; G03F7/40; H05K3/06; H05K3/18
Domestic Patent References:
| JP2006343709A | ||||
| JP2006317698A |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Junichiro Sakamaki
Hiroto Kido
Masato Ikeda
Yoshinori Shimizu
Junichiro Sakamaki
Hiroto Kido
Masato Ikeda