洗浄装置、洗浄方法、予備吐出装置、及び塗布装置

Title:

洗浄装置、洗浄方法、予備吐出装置、及び塗布装置

Document Type and Number:

Japanese Patent JP5301120

Kind Code:

B2

More Like This:

WO/2004/070473	RADIATION-SENSITIVE RESIN COMPOSITION, PROCESS FOR PRODUCING THE SAME AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE THEREWITH
JP4569801	tube
JP2007115942	APPARATUS FOR PROCESSING SUBSTRATE, ALIGNER, AND PROCESS FOR FABRICATING DEVICE

Inventors:

Yoshiaki Masu
Kenji Yoshizawa
Kazunobu Yamaguchi

Application Number:

JP2007175596A

Publication Date:

September 25, 2013

Filing Date:

July 03, 2007

Export Citation:

Assignee:

Tokyo Ohka Kogyo Co., Ltd.

International Classes:

H01L21/027; B05C11/10; B05D1/26; B05D3/10; B08B3/02; G03F7/16

Domestic Patent References:

Attorney, Agent or Firm:

Sumio Tanai
Masatake Shiga
Suzuki Mitsuyoshi
Mitsunaga Igarashi

Previous Patent: 表示装置および表示プログラム

Next Patent: 放射冷暖房用合成樹脂管、及び、放射冷暖房用パネル