Title:
電子部品の実装方法
Document Type and Number:
Japanese Patent JP5301329
Kind Code:
B2
Abstract:
In order to recognize grid-like reference marks on a jig plate positioned in a mounting area by means of a substrate recognizing camera respectively, to obtain a positional shift amount of a mounting head with respect to XY coordinates on an apparatus of each of the reference marks, and to correct a mounting position, thereby carrying out a mounting operation, a jig component positioned and mounted sequentially on each of the reference marks formed on the jig plate by means of a nozzle head is recognized by the substrate recognizing camera, a shift amount of XY coordinates acquired by the camera recognition of the jig component from XY coordinates on the apparatus of the corresponding reference mark is obtained as corrected data on the nozzle head with respect to the reference mark, and a correction is carried out based on the corrected data when an electronic component is to be mounted on a substrate by means of the nozzle head.
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Inventors:
Iwase Atsushi
Application Number:
JP2009078244A
Publication Date:
September 25, 2013
Filing Date:
March 27, 2009
Export Citation:
Assignee:
JUKI Corporation
International Classes:
H05K13/04
Domestic Patent References:
| JP11168298A | ||||
| JP2004281958A | ||||
| JP2005347555A |
Attorney, Agent or Firm:
Satoshi Takaya
Keisuke Matsuyama
Tsuyoshi Makino
Keisuke Matsuyama
Tsuyoshi Makino