Title:
電子部品の寿命計測方法、電子部品の寿命計測装置および基板の設計良否判定方法
Document Type and Number:
Japanese Patent JP5308129
Kind Code:
B2
More Like This:
Inventors:
Shunsuke
Application Number:
JP2008296972A
Publication Date:
October 09, 2013
Filing Date:
November 20, 2008
Export Citation:
Assignee:
MITSUBISHI HEAVY INDUSTRIES,LTD.
International Classes:
G01N3/32
Domestic Patent References:
| JP2005189064A | ||||
| JP2000258323A | ||||
| JP2003185551A | ||||
| JP9297010A | ||||
| JP2006030048A |
Attorney, Agent or Firm:
Noriharu Fujita
Kunio Ueda
Kunio Ueda