パッケージ基板の実装構造および電子部品

Title:

パッケージ基板の実装構造および電子部品

Document Type and Number:

Japanese Patent JP5309999

Kind Code:

B2

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Inventors:

Nobuyuki Hayashi
Yasuhiro Yoneda
Teru Nakanishi
Morita

Application Number:

JP2009001178A

Publication Date:

October 09, 2013

Filing Date:

January 06, 2009

Export Citation:

Assignee:

富士通株式会社

International Classes:

H01L23/40

Domestic Patent References:

Attorney, Agent or Firm:

Tadahiko Ito
Akinori Yamaguchi

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