Title:
貴金属ライナとこれに隣接する誘電材料間の付着性を向上させた相互接続構造およびその製造方法(金属/誘電体界面のための付着性向上)
Document Type and Number:
Japanese Patent JP5328111
Kind Code:
B2
Abstract:
An interconnect structure and method of fabricating the same in which the adhesion between a chemically etched dielectric material and a noble metal liner is improved are provided. In accordance with the present invention, a chemically etching dielectric material is subjected to a treatment step which modified the chemical nature of the dielectric material such that the treated surfaces become hydrophobic. The treatment step is performed prior to deposition of the noble metal liner and aides in improving the adhesion between the chemically etched dielectric material and the noble metal liner.
Inventors:
Ching Huang Lin
Chee Chao Yang
Terry A Spooner
Griselda Bonilla
Chee Chao Yang
Terry A Spooner
Griselda Bonilla
Application Number:
JP2007135218A
Publication Date:
October 30, 2013
Filing Date:
May 22, 2007
Export Citation:
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION
International Classes:
H01L21/768; H01L21/312; H01L21/316; H01L21/3205; H01L23/532
Domestic Patent References:
| JP2002353308A | ||||
| JP2005167081A | ||||
| JP2006124410A | ||||
| JP2002324838A | ||||
| JP2006016684A | ||||
| JP2004253671A | ||||
| JP2007254594A |
Other References:
M.K.Lane, et al,Liner materials for direct electrodeposition of Cu,APPLIED PHYSICS LETTERS,2003年 9月22日,Vol.83, No.12,p.2330-2332
Attorney, Agent or Firm:
Takeshi Ueno
Tasaichi Tanae
Yoshihiro City
Hiroshi Sakaguchi
Tasaichi Tanae
Yoshihiro City
Hiroshi Sakaguchi