Title:
コーティングを形成するための方法および装置
Document Type and Number:
Japanese Patent JP5349726
Kind Code:
B2
Abstract:
A method for forming a coating on a substrate using an atmospheric pressure plasma discharge. The method comprises introducing an atomized liquid and/or solid coating-forming material into an atmospheric pressure plasma discharge and/or an ionized gas stream resulting therefrom, and exposing the substrate to the atomized coating-forming material. The application also described a method for polymerizing a polymer forming material, and further to apparatus for forming a coating on a substrate.
Inventors:
Goodwin, Andrew
Merlin, Patrick
Badial, Jas Pal
Ward, rook
Merlin, Patrick
Badial, Jas Pal
Ward, rook
Application Number:
JP2002532368A
Publication Date:
November 20, 2013
Filing Date:
September 25, 2001
Export Citation:
Assignee:
Dow Corning Ireland Limited
International Classes:
B05D3/04; B05B5/00; B05B17/06; B05D1/10; B05D7/24; C08F2/46; C23C16/448; C23C16/503; H05H1/24
Domestic Patent References:
JP3263444A | ||||
JP3202145A | ||||
JP3143930A | ||||
JP4236764A | ||||
JP2001074907A | ||||
JP2001158976A |
Foreign References:
WO1999008803A1 |
Attorney, Agent or Firm:
Michiharu Soga
Hidetoshi Furukawa
Suzuki Kenchi
Kajinami order
Hidetoshi Furukawa
Suzuki Kenchi
Kajinami order