Title:
シリコンウエハの熱処理方法
Document Type and Number:
Japanese Patent JP5350623
Kind Code:
B2
Inventors:
Hirasawa Manabu
Koji Izumizuma
Koji Araki
Tatsuhiko Aoki
Koji Izumizuma
Koji Araki
Tatsuhiko Aoki
Application Number:
JP2007319744A
Publication Date:
November 27, 2013
Filing Date:
December 11, 2007
Export Citation:
Assignee:
Global Wafers Japan Co., Ltd.
International Classes:
H01L21/02; H01L21/324
Domestic Patent References:
| JP2005322875A | ||||
| JP2005064254A |
Foreign References:
| WO2005114716A1 |
Attorney, Agent or Firm:
Kinoshita Shigeru
Rie Ishimura
Rie Ishimura
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